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The objective of the 2nd IEEE International Conference on Decentralized Applications and Infrastructures (IEEE DAPPS 2020, formerly known as IEEE DAPPCON) is to facilitate the exchange between researchers and practitioners in the area of Decentralized Applications based on Distributed Ledger Technologies, Blockchains and related technologies. The conference will be co-located with IEEE SOSE, IEEE Mobile Cloud, IEEE BigDataService, and IEEE AITest.
It can be already seen today that Blockchain is making a huge impact on the way digital payments are made. However, the potential implications of Blockchain technologies go far beyond their application as the technological backbone for cryptocurrencies. In recent years, Decentralized Applications (dApps) have emerged as a new model for building massively scalable services.
dApps allow for various novel application scenarios, which are built upon distributed consensus and thus are hard to block or censor. While Blockchains such as Bitcoin or Ethereum are currently based on compute-intense consensus mechanisms, more recent approaches focus on voting or staking-based algorithms that support higher transactions per second and are also better-suited to reflect proportions of majority ownership, which are required in many enterprise application scenarios.
IEEE DAPPS 2020 will provide a high-quality forum for participants from research and industry. The conference will discuss key theories, algorithms, infrastructures, and significant applications for Decentralized Applications and Infrastructures, as well as emerging research topics.
Topics of interest include, but are not limited to:
IEEE DAPPS 2020 solicits research papers describing novel and previously unpublished scientific contributions to the field of Decentralized Applications and Infrastructures.
Two different types of papers can be submitted:
Regular papers should describe novel and previously unpublished scientific contributions to the field of Decentralized Applications and Infrastructures. Each regular paper is limited to 10 pages, including tables, figures and references.
Short papers aim at presenting novel work in progress, novel applications, and novel industry perspectives in the field of Decentralized Applications and Infrastructures. Each short paper is limited to 6 pages, including tables, figures and references. Short papers will also be peer-reviewed, however, they will be evaluated with a focus on the potential for establishing new ideas and for sparking the interest of participants.
All papers must be written in English. Manuscripts must include a title, an abstract with 200-250 words, and a list of 4-6 keywords. All papers must be prepared in the IEEE double column proceedings format. Please see: https://www.ieee.org/conferences/publishing/templates.html
IEEE DAPPS 2020 uses a double-blind review policy. Authors are required to remove their names, affiliation(s) and other identifying information from the header of the manuscript. This also includes meta-data in the submitted document as well as acknowledgement sections. Papers that do not meet these anonymization requirements may be rejected without further review.
Authors are encouraged, but not required, to cite their previous work in a neutral manner, for example, avoid “in our previous work ” and instead use “as shown in ”.
All submitted papers will be peer-reviewed. The name(s) of the author(s) will not be visible to the reviewers of a paper. The name(s) of the author(s) will be visible in the submission system to the General Chairs and the Program Committee Chairs. Authors should report any conflict of interest with the list of Program Committee members during submission of the manuscript, in which case the Program Committee Chairs will exclude the corresponding PC member(s) from reviewing the paper.
Authors must submit their manuscripts via the following link by
November 30 December 7, 2019, 23:59 GMT at the latest:
Authors who have submitted articles for publication by the IEEE may be interested in posting preprint versions of the same article. In order to find out more about the allowed forms of preprints and to understand what counts as a prior publication, please see IEEE's Sharing and Posting Policies as well as Section 8.1.9 on "Electronic Information Dissemination" in the IEEE Publication Services and Products Board Operations Manual.
All accepted papers will be published by IEEE Computer Society Press (EI-Index) and included in the IEEE Digital Library. For publication, each accepted paper is required to be registered by one of its authors, and at least one author is required to attend and present the paper at the conference for the paper to be included in the final technical program and the IEEE Digital Library.
The organizing committee of IEEE DAPPS 2020 can be reached via email at:
IEEE DAPPS 2020 will be co-located with five other IEEE conferences:
All five conferences will follow a common daily schedule and share some events such as keynote talks and panel discussions.
The joint conferences program will take place
from April 13 until April 16, from August 3 until 6, 2020. See the news section for updates.
Download all papers for free as part of IEEE's Open Preview program prior to the conference.
Axel Küpper, Technische Universität Berlin, Germany
Jie Xu, University of Leeds, United Kingdom
Peter Ruppel, CODE University of Applied Sciences, Germany
Stefan Schulte, Technische Universität Wien, Austria
Divyesh Jadav, IBM Research - Almaden, United States of America
Hong Zhu, Oxford Brookes University, United Kingdom
Bedour Alshaigy, Oxford Brookes University, United Kingdom
Bedour Alshaigy, Oxford Brookes University, United Kingdom
Svetlana Abramova, University of Innsbruck, Austria
Thomas Austin, San Jose State University, United States of America
Paolo Bellavista, University of Bologna, Italy
Edward Corwith Carr, North Carolina A&T University, United States of America
Sang-Yoon Chang, University of Colorado, United States of America
Chang-Wu Chen, AMIS, Taiwan
Noel Crespi, Institut Mines-Télécom, Télécom SudParis, France
Florian Daniel, Politecnico di Milano, Italy
Thilo Gottschalk, Karlsruhe Institute of Technology, Germany
Luca Guida, Politecnico di Milano, Italy
Bernhard Haslhofer, Austrian Institute of Technology, Austria
Junbeom Hur, Korea University, Korea
Salil Kanhere, University of New South Wales, Australia
Donghang Lu, Purdue University, United States of America
Gabor Madl, IBM Research - Almaden, United States of America
Pedro Moreno Sanchez, Technische Universität Wien, Austria
Alexander Norta, TalTech University, Estonia
Younghee Park, San Jose State University, United States of America
Christos Patsonakis, University of Athens, Greece
Alessandra Scafuro, North Carolina State University, United States of America
Oshani Seneviratne, Rensselaer Polytechnic Institute, United States of America
Seungwon Shin, KAIST, Korea
Hitesh Tewari, Trinity College Dublin, Ireland
Dirk Thatmann, Deutsche Telekom Laboratories, Germany
David Vangulick, University of Liege, Belgium
Friedhelm Victor, Technische Universität Berlin, Germany
Roman Vitenberg, University of Oslo, Norway
Ingo Weber, Technische Universität Berlin, Germany
Edgar Weippl, SBA Research, FH St. Pölten, Austria
Martin Westerkamp, Technische Universität Berlin, Germany
Konrad Wrona, NATO Communications and Information Agency, The Netherlands
Xiwei Xu, Data61-CSIRO & UNSW, Australia
Attila Yavuz, University of South Florida, United States of America
Kaiwen Zhang, École de Technologie Supérieure, Canada
Qi Zhou, QuarkChain, United States of America